Semiconductors and other sophisticated electronic components are vulnerable to the effects of electrostatic charges throughout the manufacturing process.

The mechanical abrading of surfaces causes electrons to flow from a supplying surface (positive charge) to a receiving surface (negative charge). As a result, dust can be attracted to clean room walls, floors and ceilings, to manufacturing equipment surfaces, and directly to circuits and contacts of semiconductor devices, with devastating effects.

Moreover, the build-up of static charges can result in uncontrolled electrostatic discharges (ESD) capable of affecting numerous devices per incident.

It is therefore essential to limit materials to those capable of dissipating static charges (10^6-8 Ohms/square surface resistivity), and to provide grounded connections by means of wiring or secure contact with other grounded materials.

Since transparent plastics are insulative by nature (≥10¹⁴ Ohm/square surface resistivity), imparting of electrical properties requires molding of opaque, conductive particles into the resin or, in the case of ESLON^® DC Plate, applying coatings that are both conductive and transparent.

ESLON DC Plate is comprised of clear plastic sheet coated on both sides with a conductive, transparent surface two-microns in thickness, providing surface resistivity in the static dissipative range of 10^6-8 Ohms/square.

To meet broad application requirements, the plastic substrate is available in PVC (best chemical and fire resistance—UL Std. 94 V-0), polycarbonate (outstanding high temperature performance and impact resistance), PMMA and A-PET (optimum clarity).

The substrates are offered in 4 colors: clear, transparent orange, transparent yellow, transparent gray, and transparent smoked bronze. The coating is available in two grades: "standard coat" and "hard coat," the latter being a cross-linked version providing superior abrasion and chemical resistance.

ESLON DC Plate (standard coat) is also heat-formable using conventional "drape forming" and "wire forming" methods, allowing two-dimensional bends up to 90° as well as compound curves.